AI chip startup SUNMMIO raises nearly RMB 2 billion in funding
Beijing-based AI chip startup SUNMMIO has secured nearly RMB 2 billion (approx. $275 million) in funding across its Pre-A2 and Series A rounds. The investment was led by state-backed entities in Beijing.
Beijing-based AI chip startup SUNMMIO has completed its Pre-A2 and Series A financing rounds, raising close to RMB 2 billion (approximately $275 million) in total over the past year. The latest funding rounds were led by state-backed investment platforms in Beijing, including Yizhuang State Investment.
SUNMMIO focuses on developing 3D-stacked chips designed for large-model AI inference. The company intends to allocate the newly acquired capital towards expanding its research and development team, advancing its proprietary technology, and accelerating the mass production of its 3D TokenPU processors.
The startup's first-generation A4E chip completed its tape-out in June. This chip features a design where eight memory wafers are stacked atop a logic wafer, reportedly achieving a memory bandwidth of 16 terabytes per second. This specification aims to address data transfer bottlenecks that typically hinder AI inference performance.