AI Memory and Storage Innovation Summit Concludes in Shenzhen

The 5th GMIF2026 Innovation Summit successfully concluded in Shenzhen on September 23. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits at Peking University, the summit's theme was "The Future Built on AI Memory and Storage."

The event brought together industry stakeholders, including integrated device manufacturers (IDMs), controller and memory solution providers, OSAT companies, equipment and material suppliers, server and AI infrastructure vendors, and developers of automotive electronics and AI applications. Academic institutions and investors also participated.

Discussions delved into the evolution of memory and storage technologies, industry trends, and application innovations within the AI era. As AI training and inference workloads continue to scale, the boundaries of memory and storage technology are expanding. The summit specifically explored inference efficiency, enterprise-grade storage solutions, and cloud-edge-device coordination to support AI.

Organizers SMIA and Peking University aim to foster technical exchange and collaboration between storage companies and other players in the AI ecosystem. The meeting highlighted how the rapid advancements in AI are increasing the strategic value and demand for memory and storage solutions.