AltoBeam Launches Domestic Wi-Fi 7 Data Transmission Chip
Chinese semiconductor firm AltoBeam has introduced the ATBM6175, its first Wi-Fi 7 compliant SoC, featuring a peak physical layer rate of 720Mbps.
Beijing-based chip designer AltoBeam has announced the ATBM6175, the company's first system-on-a-chip (SoC) supporting the IEEE 802.11be standard, also known as Wi-Fi 7. The launch represents a shift in the local semiconductor market toward the latest generation of wireless communication technology.
The ATBM6175 utilizes 80MHz channel bandwidth and 4096-QAM modulation to achieve a peak physical layer transmission rate of 720Mbps. Key features include the integration of Multi-Link Operation (MLO) technology, which is designed to improve data throughput and reduce latency in congested wireless environments.
AltoBeam has optimized the chip’s RF front-end and baseband architecture to lower overall system power consumption and reduce external hardware requirements. The design specifically addresses common interference issues by implementing a collaborative architecture between Wi-Fi 7 and Bluetooth signals, aimed at preventing connectivity drops in devices using multiple wireless peripherals simultaneously.
This release positions AltoBeam to compete in the domestic market for network infrastructure and consumer electronics, where demand for higher-speed wireless connectivity continues to rise. The company expects the chip's power-efficient architecture to facilitate easier hardware integration for device manufacturers transitioning to the Wi-Fi 7 standard.