Applied Materials Launches Deposition Systems for Advanced Logic Chips
Applied Materials has introduced two new chipmaking systems designed for fabricating angstrom-era logic chips. These systems enable atomic-level precision in materials deposition, crucial for next-generation semiconductor performance.
Santa Clara, California – April 08, 2026 – Applied Materials, Inc. has unveiled two new chipmaking systems engineered to create the smallest features in the world's most advanced logic chips. These technologies are critical for building faster and more power-efficient transistors required for the scaling demands of global AI infrastructure.
The semiconductor industry is pushing the boundaries of scaling to achieve greater performance per watt, especially as chipmakers adopt new architectures like Gate-All-Around (GAA) transistors at the 2nm node and beyond. These advanced transistors involve complex 3D structures requiring over 500 process steps, many of which necessitate novel approaches to material deposition with atomic-level precision and control.
Applied Materials' new systems include the Precision™ Selective Nitride PECVD system and the Trillium™ ALD system. The Precision™ system uses a selective bottom-up deposition process to apply silicon nitride within shallow trench isolation (STI) structures. This preserves the integrity of the isolation, which is vital for preventing parasitic capacitance and improving performance-per-watt, especially as these structures become smaller and more prone to degradation during subsequent processing steps.
"Our industry is entering a period of rapid, non-linear change, where traditional lithographic chip scaling alone is no longer sufficient," said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. "At the most advanced angstrom-class logic nodes, performance and power are increasingly determined by materials. Thanks to our foundational leadership in materials engineering, these deposition systems will enable our customers to deliver critical transistor inflections that are foundational to the AI computing roadmap."
Leading foundry and logic chip manufacturers are already utilizing these new systems for 2nm and beyond processes. The introduction of these technologies supports the ongoing advancements in AI computing, addressing the need for enhanced transistor performance and energy efficiency.