ASM Pacific Technology Wins Third Technological Achievement Award
ASM Pacific Technology Ltd. (ASMPT) has received the Grand Award for Technological Achievement at the Hong Kong Awards for Industries 2017. This marks the third time the company has secured this recognition.
Hong Kong - ASM Pacific Technology Ltd. (ASMPT), a provider of semiconductor assembly and packaging equipment and surface mount technology solutions, has been honored with the Grand Award for Technological Achievement at the Hong Kong Awards for Industries 2017. This is the third instance of ASMPT receiving this accolade, having previously won in 1999 and 2015.
The award recognizes ASMPT for its innovative Active Alignment Solution, a technology critical for manufacturing CMOS camera modules (CCM) for smartphones. This system is designed to achieve optimal optical performance for image capture.
According to the company, its Active Alignment system is utilized in the assembly of over 80% of high-end mobile phone CCMs globally. The IS600GS platform, developed by ASMPT's Hong Kong R&D team, is engineered for high-volume manufacturing, aiming to provide customers with high productivity, low cost of ownership, and superior quality.
ASMPT maintains a commitment to research and development, allocating up to 10% of its annual equipment revenue to R&D initiatives. The company also focuses on nurturing young engineering talent through collaborations with universities and technical institutes.