BOE Technology Establishes Project Group for Micro LED, Optical Interconnects, and CPO
Chinese display manufacturer BOE Technology has formed a technical task force to advance Micro LED optical interconnect systems and CPO technology using glass substrates. The company is also deepening its collaboration with Corning.
BOE Technology, a prominent Chinese display manufacturer, has established a technology development project group focused on Micro LED optical interconnect systems and Co-Packaged Optics (CPO) utilizing glass substrates. This initiative aims to accelerate advancements in optical interconnect technologies.
The company announced the formation of this dedicated group, which will collaborate with ecosystem partners on forward-looking research and development. The objective is to expedite technological breakthroughs in the field of optical interconnects.
In parallel, BOE is intensifying its partnership with glass substrate manufacturer Corning. Both entities are working together to advance projects related to glass-based packaging substrates, optical interconnects, perovskite solar cells, and foldable glass solutions. Progress on these collaborative efforts will be reviewed on a quarterly basis.
BOE also provided updates on its LCD and OLED business segments. While shipments for mainstream LCD applications may face pressure due to rising component costs, the company anticipates growth in delivered area driven by the accelerating trend towards larger screen sizes. The ongoing optimization of the TV supply-demand landscape is supported by the retirement of older production lines.
For the OLED segment, BOE expects increased shipments of small-sized, high-value displays, which should bolster demand for LTPO technology. In the mid-sized display sector, the introduction of new AI PC models and the ramp-up of production at its 8.6th-generation AMOLED line are expected to accelerate the adoption of OLED technology in IT applications.