CFMEE Secures Order for PLP Lithography Equipment
Chinese lithography equipment manufacturer CFMEE announced on July 3rd that it has received a significant order for its PLP 2000 direct-write lithography system targeting advanced packaging.
Chinese micro and nano direct-write lithography equipment manufacturer CFMEE (Changzhou Changhua Microelectronics Equipment Co., Ltd.) announced on July 3rd that it has secured a significant order for its newly developed PLP 2000 direct-write lithography equipment.
The equipment is reported to be the first 510mm x 515mm PLP (Package on Package) direct-write lithography machine developed in China. It is specifically designed for large-size substrate packaging applications and supports substrates up to 600mm x 600mm.
CFMEE's PLP 2000 equipment is stated to achieve a 2-micrometer resolution capability in mass production, which is a requirement for advanced packaging processes such as CoPoS, glass substrates, and FOPLP.
The company highlighted that the equipment's systematic design addresses large-area exposure, pattern resolution, panel uniformity, and consistency across the entire substrate. These features are intended to ensure process stability during the processing of large substrates.