China's First 3D Advanced Packaging Production Line Operational in Wuhan

China's first mass production line for 3D advanced chip packaging became operational in Wuhan on September 30. The facility, operated by Hubei Xingchen Technology Ltd. (Xingchen Technology), represents a major stride in the nation's pursuit of self-sufficiency in high-end chip packaging.

The combined investment in Xingchen Technology's advanced packaging pilot platform, encompassing both its first and second phases, exceeds 7 billion yuan (approximately $1 billion USD). The second phase, initiated in October 2025, achieved its operational launch within an accelerated 11-month timeframe, reflecting rapid progress within the domestic semiconductor industry.

The new production line is designed to simultaneously support pilot production and risk manufacturing for 40 to 50 different chip designs. Furthermore, it will facilitate performance validation for 30 to 40 sets of domestic semiconductor equipment and materials. The second phase has also enhanced capabilities for 2.5D packaging.

Upon full operation, the line will offer packaging services for chips destined for high-performance AI computing, smart terminal devices, integrated storage and computing solutions, and opto-electronic integration. This advancement strengthens China's position within the global semiconductor supply chain.