E&R Engineering to Open New Plant in Malaysia for Packaging Materials
E&R Engineering is expanding its global production of semiconductor packaging materials with a new subsidiary and plant in Malaysia's Melaka Free Trade Zone.
KAOHSIUNG, Oct. 4, 2026 – E&R Engineering Corp. (TWSE: 8027), a provider of semiconductor packaging equipment, announced the upcoming opening of its new Malaysian subsidiary, E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD., at the Melaka Free Trade Zone.
The new facility is set to increase the company's global production capacity for semiconductor packaging materials. It will also focus on providing localized services to customers in Malaysia and the wider Southeast Asian market.
The expansion is expected to strengthen E&R Engineering's position in the international market and improve supply chain efficiency in the region. This move aims to address the growing demand within the semiconductor industry.
The investment in the new plant is intended to streamline local production and reduce lead times for clients in Asian markets. The company anticipates that the facility will significantly contribute to its global growth.