European Chipmaker SiPearl Partners with Egis for Rhea2 Processor Development
European CPU developer SiPearl has entered a strategic partnership and investment agreement with Taiwan-based semiconductor firm Egis to co-develop the upcoming Rhea2 processor.
SiPearl, a European startup focused on high-performance computing CPUs, announced a collaboration with Taiwan's Egis Technology on October 22. The deal involves both strategic cooperation and direct investment to support the development of SiPearl’s next-generation Rhea2 chip.
The Rhea2 processor will utilize the architecture found in the Mobius100 server CPU, a joint project between SiPearl and Egis subsidiary Alcor Micro. The Mobius100 is built on the Arm Neoverse V3 platform and utilizes TSMC's N3P manufacturing process. It features a 128-core chiplet design with additional redundant cores, support for high-speed DDR5 MRDIMM memory, and PCIe Gen6 connectivity.
To facilitate data transfer, the architecture integrates IP from InPsytech, another Egis subsidiary, providing eight UCIe 2.0-S interfaces. The Mobius100 is scheduled for engineering samples in 2027, with mass production expected by the second half of 2028. The Rhea2 processor is slated for release following the production of the Mobius100.