FANUC America to Showcase AI Robotics and Packaging Automation at Pack Expo

FANUC America is set to present its latest advancements in artificial intelligence (AI), collaborative robotics, and machine vision at PACK EXPO International 2026 in Chicago. The company aims to showcase how these technologies can assist packaging and processing firms in overcoming challenges such as labor shortages and increasing production complexity.

The technology demonstrations will include AI-driven robotic palletizing and quality inspection of packaging using real-time machine vision. FANUC will also feature its collaborative robot (CRX) series, designed to work safely alongside human operators without the need for safety caging. These solutions are intended to enhance efficiency and flexibility in packaging operations.

As a global leader in industrial automation, FANUC America's participation at the event underscores its commitment to providing solutions that streamline manufacturing processes. The company highlights its ability to automate the handling and packaging of complex products, thereby freeing up human workers for more specialized or less repetitive tasks.

PACK EXPO International serves as a key platform for industry professionals to explore the latest trends and innovations in packaging and processing. FANUC's presence will focus on demonstrating practical applications of advanced automation to meet evolving market demands and improve operational competitiveness.