Fibocom Unveils SC153 5G Smart Module on Qualcomm Platform

Fibocom unveiled its SC153 5G smart module for the first time at NetworkX 2026. The module, built on the Qualcomm Dragonwing™ Q-4390 processor, is designed to meet the requirements of next-generation smart devices for high-speed connectivity and complex applications.

The module supports 3GPP Release 16 and offers 5G NR sub-6 GHz and LTE connectivity. It supports both 5G standalone (SA) and non-standalone (NSA) network architectures, delivering maximum downlink speeds of 2.3 Gbps in SA mode and 2.5 Gbps in EN-DC mode. These capabilities enable stable data transmission for applications including high-definition video and industrial equipment.

SC153 is designed for flexibility across diverse device requirements. It uses an LGA package and provides a wide range of interfaces, including MIPI display, MIPI camera, USB 3.1, and SD. Additionally, it flexibly supports Wi-Fi 5, Wi-Fi 6E, and Wi-Fi 7 configurations. The module also supports the Android operating system, facilitating software development and customization.

Fibocom states the module will help customers develop new generation wireless products for smart devices, industrial equipment, and high-speed data applications. Mass production is scheduled to begin in the fourth quarter of 2026.

Qualcomm's Edward Ai highlighted the accelerating convergence of 5G and application processing for smart device innovation. Fibocom's Thales Zhang noted that the SC153 is a key addition to the company's portfolio, aiming to translate new connectivity capabilities into deployable devices more quickly.