Fraunhofer develops new process for microchip manufacturing

The Fraunhofer Institute for Silicon Technology ISIT and IMS Nanofabrication GmbH have jointly developed a groundbreaking technology for microchip manufacturing. This new method allows for the production of smaller and more powerful chips, pushing beyond previous limits in chip miniaturization.

The research, unveiled in April 2021, centers on a micro-electromechanical system (MEMS) switching element. This element is a critical component in a new electron multi-beam mask writer, a key piece of equipment for producing the latest generation of microchips. While the industry has continuously pursued smaller and more powerful microchips, manufacturing technologies were reaching their physical limits.

The new process enables process sizes of seven nanometers and below, an advancement from the previous limit of just under ten nanometers. This achievement is globally unique, positioning the electron multi-beam mask writer as the sole technology currently capable of further miniaturizing chips. IMS Nanofabrication GmbH has leveraged this technology to solidify its market-leading position.

At the core of the technology is the MEMS switching element developed by Fraunhofer ISIT. Instead of using a single beam to write mask structures, the new method employs over 262,000 simultaneous electron beams. Each individual beam can be precisely controlled and redirected by specialized electrodes, allowing for the creation of complex structures at high speed and resolution.

This development was recognized with the 2021 Joseph von Fraunhofer Prize. The technology not only facilitates further microchip miniaturization but has also brought significant commercial success to IMS, with annual revenues of approximately $400 million from this technology. Fraunhofer ISIT's industrial revenue has also surged to over one million euros annually.