📣 Send us your press release
Site updates every 15 minutes
Technology

FSP launches M370 ATX chassis with corner see-through design

Tech company FSP (全汉) has introduced the M370 ATX mid-tower chassis, featuring a dual-chamber layout and a distinctive corner see-through tempered glass side panel.

3 July 2026
FSP launches M370 ATX chassis with corner see-through design
Image is an AI-generated illustration

Tech company FSP (全汉) has officially unveiled the M370, an ATX mid-tower computer chassis designed for PC builders. The case distinguishes itself with a dual-chamber layout, separating components into upper and lower sections for optimized thermal performance and aesthetics. It features a unique corner see-through design with double tempered glass panels. Constructed from SPCC steel of 0.8-0.6mm thickness, the M370 measures 242 x 430 x 475 mm and includes four pre-installed fans. The chassis offers seven expansion slots and supports 'back-plug' motherboards, where cables are routed through the rear. It accommodates graphics cards up to 400mm in length, ATX power supplies up to 220mm, and CPU air coolers up to 180mm tall. Storage options include one 3.5-inch drive bay and a mixed bay supporting either a 3.5-inch or 2.5-inch drive. The front panel offers connectivity with two USB-A 5Gbps ports and one USB-C port. For cooling, the M370 comes with three 120mm PWM ARGB fans pre-installed on the front-right side. The top panel supports up to three 120mm or two 140mm fans, or a 360mm All-In-One (AIO) liquid cooler. An additional 120mm ARGB fan is pre-installed at the rear, ensuring effective airflow throughout the build.

Original source: ithome.com