Fujifilm completes new semiconductor materials plant in Oita, Japan

Fujifilm announced on August 20 the completion of its new semiconductor materials factory located in Oita Prefecture, Japan. The production facility is dedicated to manufacturing cleaning agents for chemical-mechanical polishing (CMP) post-treatment.

The new plant will result in a threefold increase in production capacity for related products at the Oita factory. These cleaning agents are designed to remove particles, metallic impurities, and organic residues while protecting metal surfaces.

Fujifilm anticipates that sales revenue from these products will at least double by 2030 compared to 2024 levels. Semiconductor materials have become a core growth business for Fujifilm, achieving a compound annual growth rate (CAGR) exceeding 20% in fiscal years 2021–2025.

The company is actively expanding its production capacity for CMP slurries, post-cleaning agents, and photosensitive insulating films such as polyimides. This expansion aims to meet the growing demand from wafer fabrication plants in the AI era.