Great Lakes Semiconductor Launches First Innovation Funnel Project

Great Lakes Semiconductor (GLS) has launched the first project on its Great American ChipForge platform as part of its Innovation Funnel initiative. Based in Fishkill, New York, the project aims to meet strong industry demand for intelligent, AI-enabled sensor solutions, with a focus on vehicle applications.

The company stated that the project leverages GLS's distributed, end-to-end integration capabilities. This includes multiple design centers, modular wafer fabrication via ChipForge, and integrated packaging and testing through FINPAT™. GLS is collaborating with several ecosystem partners across various stages, from design and fabrication to packaging and testing. These partners include Neitas, Daikin, BlueDot Ventures, FMC, and Advanced Printed Electronic Solutions (APES).

According to Dr. Richard Thurston, Chairman & CEO of GLS, the launch of this Innovation Funnel project will demonstrate the seamless integration within the ChipForge ecosystem and accelerate the time-to-market for new products. "We can quickly turn innovative concepts from our design centers into fully packaged prototypes that are ready for production scale," Dr. Thurston said.

The ChipForge platform is described as a flexible and modular wafer fabrication system designed to support various semiconductor processes and materials. Its modular configuration allows for tailored production lines for distinct applications, such as memory, logic, and sensors. GLS intends to connect multiple specialized production lines within a unified, distributed semiconductor manufacturing platform.