HDP and Global Electronics Association Release New Copper Profile Test Method

The High Density Packaging User Group (HDP) and the Global Electronics Association have jointly developed and released a new standardized test method, designated IPC-TM-650-2.2.23. This method is derived from the results of HDP's research project focused on measuring copper foil profiles without direct physical contact.

This new testing methodology is specifically designed for high-speed and high-performance electronic applications where a lower copper roughness profile is essential for maintaining signal integrity. Larry Marcanti, Executive Director of HDP User Group, highlighted the significance of this development for such demanding applications.

Matt Kelly, CTO at the Global Electronics Association, stated that the empirical data gathered by HDP was crucial in establishing this new test standard. He added that the organizations intend to continue their collaboration to ensure that standards and test methods evolve alongside technological advancements.

The Global Electronics Association, formerly known as IPC, is a global trade association for the electronics industry, supporting member companies across the supply chain from design to testing. The HDP User Group operates as an international research and development organization aimed at reducing costs and risks in electronics manufacturing associated with advanced packaging and assembly technologies.