Hua Hong Semiconductor launches mass production of 90nm BCD process on 12-inch line
Hua Hong Semiconductor has begun mass production of its 90nm BCD process at its 12-inch Wuxi facility to address demand for advanced power management integrated circuits.
Hua Hong Semiconductor has transitioned its 90nm BCD (Bipolar-CMOS-DMOS) process technology to mass production at its 12-inch fabrication plant in Wuxi. The move aims to provide improved electrical performance and reduced chip sizes for applications including digital power supplies and audio amplifiers.
The adoption of this process allows for greater design integration, as the company expands its range of CMOS and LDMOS device types. By scaling these capabilities at the 12-inch node, Hua Hong seeks to offer more cost-effective solutions for clients in the power management, automotive, and industrial control sectors.
Executive Vice President Fan Heng stated that the company is intensifying its focus on power management technologies to meet the increasingly complex performance requirements of modern intelligent hardware. The Wuxi facility remains central to the company’s specialty foundry strategy, bridging the gap between standard logic manufacturing and high-performance power discrete semiconductors.