Hua Hong Semiconductor's 3rd-Gen 90nm eFlash Platform Achieves Mass Production

Hua Hong Semiconductor Ltd, a leading global specialty pure-play foundry, has announced the mass production of its third-generation 90nm embedded flash (eFlash) process platform. This milestone underscores the company's continuous innovation and enhanced competitiveness in the embedded Non-Volatile Memory (eNVM) technology sector.

The new 90nm eFlash platform boasts a nearly 40% reduction in flash cell size compared to its second-generation counterpart, establishing a new benchmark for embedded flash technology at this process node globally. The smaller cell size translates directly to reduced overall chip dimensions, enabling higher die counts per wafer. Furthermore, a streamlined manufacturing process with fewer mask layers has shortened production cycles while maintaining high reliability, offering 100,000 write/erase cycles and 25-year data retention.

Hua Hong Semiconductor has successfully introduced three generations of its 90nm eFlash process platforms, focusing on delivering cost-effective solutions without compromising technological leadership. The stable mass production of this latest generation ensures continued support for critical applications such as smart cards, security chips (including SIM cards, Ukeys, and traffic cards), and various microcontroller products.

"As a leader in eNVM technology, Hua Hong Semiconductor will continue to focus on the research and development of 200mm differentiated technologies," stated Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor. "We aim to address the markets for high-density smart cards and high-end microcontrollers by providing significant optimizations in power consumption and chip size. We are also extending our existing 200mm technological advantage to 300mm, to better serve both domestic and international design houses and meet evolving market demands."