Huawei Develops Ascend 960 Chip and NPO Supernode
Huawei announced its Ascend 960 chip development is ahead of schedule, alongside the launch of an NPO-based supernode featuring 4,096 chips.
Huawei announced on Tuesday that development of its Ascend 960 chip is progressing ahead of schedule, with specific models slated for release in early and late 2027.
The company also unveiled its NPO-based supernode, powered by the Ascend 960 and Hi-ONE. This new system integrates 4,096 chips, offering a computing power of up to 8 EFLOPS of FP8 and 1 PB of HBM capacity. Huawei stated that this configuration significantly reduces power consumption and optical module requirements.
During the Huawei Connect 2026 event in Shanghai, the company reported that over 1,000 Ascend 910C supernodes are now deployed, and Ascend 950 supernodes have entered commercial use. This indicates a steady rollout of Huawei's high-performance computing infrastructure.
Additionally, Huawei reported that its openEuler operating system has surpassed 20 million installations, establishing it as the leading server OS in China by market share. This growth highlights Huawei's expanding influence in both hardware and software segments.