Huawei Displays Kirin 9050 Pro Chip
Huawei showcased its Kirin 9050 Pro chip at a technology event in Shanghai, marking the company's first logically foldable chip. The component was displayed physically for the first time.
Shanghai – Huawei presented its new Kirin 9050 Pro chip to the Chinese press at a technology communication meeting in Shanghai. The chip was on physical display for the first time as part of the HUAWEI Mate XT 2 foldable phone.
The Kirin 9050 Pro is described by Huawei as the world's first logically foldable chip. This marks a significant moment for the company, as it presents its branded Kirin chips again after a multi-year hiatus. Further official details regarding the chip's specifications are expected to be revealed at a dedicated session.
The chip originally debuted with the Mate XT 2 triple-folding phone in early September. Huawei had announced new Kirin chips at a flagship event then, the first such announcement in six years. The Kirin 9050 Pro integrates a Lingxi CPU, a Mali GPU, and a Da Vinci architecture-based NPU.
At the Mate 90 series launch, it was stated that devices featuring the Kirin 9050 Pro would see substantial performance increases over previous generations. The Mali GPU's compute units and cache have been doubled, and the NPU supports running large language models with up to 30 billion parameters on-device.