Huawei Unveils First Day Innovations at Technology Conference
Huawei presented ten new technologies at its innovation conference in Shanghai, including new displays, chips, and architectures.
Huawei began its two-day innovation technology communication conference in Shanghai on October 10, showcasing a range of new technologies intended for its device portfolio on the first day.
The first day of the event introduced ten key technologies. These include the Linglong Display, Lingdun Privacy Display, Kunlun Glass, Huawei Yuezhang, Kirin Chips, XMAGE Huawei Ruiying imaging technology, Xuanwu Architecture, Tiangong Hinge, Xingji Positioning, and Jingmi Call technology.
These technologies cover a broad spectrum of device components and software capabilities. The introduction of Kirin Chips and Xuanwu Architecture, in particular, suggests a focus on enhancing hardware performance and efficiency.
The second day is expected to introduce additional technologies such as the Yunxi Soft Light Screen, Xiaoyi AI assistant, Fangzhou Engine, Xingyao connectivity, HarmonyOS ecosystem-related security and computing solutions, the TruSense perception system, and the JuJing battery.
The conference highlights Huawei's ongoing investment in research and development and technological advancement as it aims to improve user experience and maintain its competitive edge in the smart device market.