Infineon Releases 256Mb HYPERRAM 2.0 Memory via Mouser
Infineon Technologies has launched its 256Mb HYPERRAM 2.0 memory devices, S80KS2562 and S80KS2563, now available through Mouser Electronics. The new memory chips offer high-speed data transfer and low-power operation for embedded systems.
Infineon Technologies has introduced its 256-megabit HYPERRAM 2.0 memory devices, the S80KS2562 and S80KS2563, which are now available through global semiconductor distributor Mouser Electronics.
These memory devices are designed for high-performance embedded systems that require expansion memory for scratchpad or buffering purposes. The S80KS2562 utilizes a HyperBUS interface, while the S80KS2563 features an Octal xSPI interface. Both devices support a maximum clock rate of 200MHz, achieving a data throughput of up to 400MBps. They also incorporate power-saving features such as Hybrid Sleep and Deep Power-Down modes.
The low-pin-count architecture of HYPERRAM makes it suitable for cost-sensitive and board-space-constrained applications. The memory devices are supplied in a 24-ball Fine-Pitch Ball Grid Array (FBGA) package and are manufactured using a 25nm DRAM process.
Applications include automotive instrument clusters, infotainment and telematics systems, industrial and consumer HMI display panels, machine vision, and wearable devices. Mouser provides technical datasheets and support materials for these new memory solutions from Infineon.