Infineon Urges TSMC to Build Additional European Chip Plant

Infineon, a semiconductor manufacturer with a 10% stake in TSMC's European subsidiary ESMC, has indicated a desire for TSMC to establish additional production facilities in Europe.

Alexander Gorski, Infineon's Executive Director for Production, stated at the Bavarian Semiconductor Conference in Munich that TSMC must build another factory in Europe utilizing smaller-line-width manufacturing processes.

The first ESMC wafer fabrication plant is located in Dresden, Germany. The total investment exceeds 10 billion euros, with a planned monthly capacity of 40,000 wafers. Construction for this facility began in August 2024, aiming for equipment installation by 2027.

Upon completion, the Dresden plant will support 28/22nm planar CMOS and 16/12nm FinFET transistor technologies. Infineon's call highlights the ongoing demand for advanced semiconductor manufacturing capabilities within Europe.