Intel Begins High-Volume Production of High NA EUV Logic Chips

Intel has announced it is the first company globally to achieve high-volume production of logic chips utilizing High NA EUV (High Numerical Aperture Extreme Ultraviolet) lithography technology.

The process, which uses ASML's equipment, is being applied to parts of Intel's 18A process node for the production of Intel Core Ultra Series 3 processors, codenamed Panther Lake. Both companies confirm that certain layers on the Intel 18A process have completed High NA EUV dual patterning qualification, with yields reaching levels comparable to existing NXE EUV platforms. The companies plan to continue developing this technology for future process nodes.

Intel and ASML completed the integration of the industry's first commercial High NA EUV lithography system at Intel's research facility in Hillsboro, Oregon, in 2024. Intel was the first customer to install and pass acceptance tests on the second-generation TWINSCAN EXE:5200B system. This system builds on the TWINSCAN EXE:5000 platform, aiming to enhance throughput, overlay accuracy, and light source performance.

Rival TSMC has previously stated that while they have acquired High NA EUV equipment, they are not currently deploying it for mass production due to high costs. The Taiwanese chipmaker is focusing on reducing costs and maximizing the technology's benefits before wider adoption.