Intel expects 1.4nm process performance within 5% of TSMC
Intel anticipates its upcoming 1.4nm logic semiconductor process will perform within 5% of TSMC's equivalent technology. The company aims for its foundry business to reach profitability by the end of 2027.
Intel projects that its upcoming 1.4 nanometer (nm) logic semiconductor process will achieve performance within 5% of competitor TSMC's equivalent technology. This forecast suggests a narrow performance gap between Intel's 14A process and TSMC's A14 process.
The projections originate from a report by investment bank KeyBanc Capital Markets, referenced on social media. According to the report, Intel Foundry Services General Manager Naga Chandrasekaran believes the company can achieve profitability in its foundry business by the end of 2027. Reaching this goal would require approximately 40,000 external customer wafer orders per month.
Intel has demonstrated significant improvements in its manufacturing capacity and process quality. Its Intel 18A process reportedly has a production capacity nearing 30,000 wafers per month, with performance positioned between TSMC's N3 and N2P nodes. The Intel 14A process is also experiencing rapid ramp-up, currently supporting a capacity of 14,000 wafers per month.
Despite progress, Intel's foundry business faces ongoing challenges. The company needs to enhance yield for large-format chips required by hyperscale customers and improve the yield of its EMIB-T substrates. Additionally, Intel must resolve issues related to backside power delivery on the Intel 14A process with its mobile clients.