JSR, Inpria, and Lam Research Sign Agreement to Advance Semiconductor Manufacturing
An agreement between JSR Corporation, its subsidiary Inpria, and Lam Research aims to accelerate next-generation semiconductor manufacturing, including dry resist technology for EUV lithography.
JSR Corporation, including its subsidiary Inpria, and semiconductor fabrication equipment supplier Lam Research have entered into a cross-licensing and collaboration agreement.
The agreement is intended to advance the semiconductor industry's transition to next-generation manufacturing processes, particularly dry resist technology for EUV lithography. It also aims to accelerate the development of new materials for atomic layer etching and deposition processes.
The collaboration combines JSR/Inpria's metal oxide-based resist materials with Lam Research's deep expertise in deposition, etch, and EUV patterning technologies. Lam Research's Aether® dry resist equipment is a key part of this initiative, which aims to reduce the cost of manufacturing the complex patterns required for chips used in artificial intelligence and high-performance computing.
The companies will jointly develop solutions, integrating JSR/Inpria's resists with Lam Research's etch and dry resist deposition technologies. Additionally, new precursor materials and processes for atomic layer deposition and etch solutions will be explored, leveraging JSR's recently acquired Yamanaka Hutech Corporation.
As part of the agreement, JSR/Inpria and Lam Research have also agreed to dismiss all mutual legal claims in the litigation previously filed in the Delaware District Court.