Lantech to Showcase Packaging Automation at PackExpo in Chicago
Lantech is exhibiting at PackExpo International 2024 in Chicago, presenting new packaging automation technologies. The company will feature its SL Automatic stretch wrapper with updates aimed at reducing downtime and film consumption.
Lantech, a manufacturer of packaging automation equipment, will showcase its latest solutions at PackExpo International 2024, held from November 3-6 in Chicago. The company aims to highlight advancements in efficiency, reliability, and sustainability for packaging operations.
At the exhibition, Lantech is introducing several new technologies. Enhancements to the SL Automatic stretch wrapper are designed to minimize downtime and reduce film usage, impacting overall productivity and cost savings. The company is also bringing its line of tray erectors to the Americas market. Lantech claims these machines are built for rigorous demands and consistent results.
The display will include Lantech's QL400XT and Q300 semi-automatic stretch wrappers, focusing on ease of use and reliable load containment. Additionally, the company will present its C300 and C1000 case erectors, designed for various operational speeds and space constraints.
Lantech will also demonstrate its LINC IoT solution for real-time machine performance monitoring, providing insights to improve uptime and productivity. The company plans to discuss current packaging legislation and methods for reducing carbon footprints.
Attendees are invited to visit Lantech at booth N-5106 to experience the new technologies and discuss solutions with the company's experts.