Lens Technology and Intel Sign Memorandum of Understanding for Advanced Packaging

Chinese component supplier Lens Technology has signed a memorandum of understanding with US technology firm Intel, focusing on advanced packaging technology utilizing Through-Glass Via (TGV). This collaboration aims to leverage the strengths of both companies within the semiconductor industry.

The MoU outlines key areas for TGV packaging, including glass substrate perforation, high-precision laser processing, metallized via deposition, and multi-layer interconnection. Intel is set to provide architectural information, design for manufacturability (DFM) guidelines, and validation methods, while Lens Technology brings its long-term technical accumulation and pilot production line for these processes. The company has already supplied samples to potential clients and is seeing initial concept validation and technical testing.

The partnership may also extend to other areas, such as structural components and modules for AI PCs, high-reliability structural components and cooling modules for data center servers, and applications in robotics and edge computing hardware. Any further collaboration beyond the TGV focus would require separate, formal agreements.

Lens Technology views this understanding with Intel as a step towards a stable, long-term strategic partnership. The company anticipates this will accelerate the application of new technologies and contribute to its mid-to-long-term strategic objectives.