LG Electronics Named NVIDIA Preferred Partner for Power and Cooling Solutions
LG Electronics has joined the NVIDIA Partner Network as a Power and Cooling Solution Preferred Partner. The collaboration strengthens LG's thermal management capabilities for high-density AI data centers.

LG Electronics has officially joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner. This partnership enhances LG's role in providing thermal management solutions for AI-driven data centers.
As AI data centers increasingly demand greater cooling efficiency to manage rising thermal loads, LG is expanding its portfolio of high-efficiency liquid cooling solutions. These solutions are designed for integration during the early stages of facility planning, supporting the development of infrastructure that meets the power and thermal management requirements of next-generation AI factories.
LG's largest 2.6-megawatt (MW) Coolant Distribution Unit (CDU) recently achieved NVIDIA DSX Ready qualification. The company has also completed CDU qualifications for 600kW and 1MW units, meeting stringent technical criteria for cooling performance and failover capabilities. These NVIDIA qualifications demonstrate LG's expertise in liquid cooling for high-density AI infrastructure.
The CDU units are engineered to manage the significant thermal demands of AI infrastructure. By implementing a direct-to-chip (DTC) liquid cooling solution that delivers coolant directly to the CPU, GPU, and other heat-generating components, these units operate in synergy with existing air-cooling infrastructure.