LG Electronics Unveils Modular Cooling for AI Data Centers

LG Electronics has unveiled a new modular cooling system designed for artificial intelligence data centers. The technology was presented at the Data Center World Asia 2026 event in Singapore on September 29.

The system, named Hydronic Modular, utilizes factory-built container units. These units are connected on-site, reducing on-site construction work and allowing for phased capacity expansion. The solution includes pre-assembled pumps, valves, buffer tanks, and piping within ISO-standard containers.

The company also displayed air-cooled, oil-free inverter turbo chillers, Fan Wall Units, and liquid-cooling coolant distribution units in 1-megawatt and 2.6-megawatt classes. These cooling solutions are critical for managing the heat generated by high-performance AI servers that require efficient temperature regulation.

LG Electronics announced that Nvidia has certified its coolant distribution units in the 600-kilowatt to 1-megawatt classes, and in the 2.6-megawatt class. This collaboration highlights LG's focus on integrating into the AI infrastructure development. Additionally, other LG Group affiliates, including LG Energy Solution and LG CNS, showcased their own offerings, such as batteries for backup power and prefabricated data center modules.

The launch follows Singapore's recent introduction of a standard for liquid cooling in data centers within tropical climates, aiming to enhance energy efficiency and performance. LG's new system addresses the growing demand for robust cooling solutions in the expanding AI data center market.