Linktel Technologies Showcases 1.6T LPO Solutions for AI Data Centers

Linktel Technologies showcased its optical interconnect portfolios engineered for next-generation AI computing networks at the 2026 OCP Global Summit in San Jose on October 18, 2026. The company's 1.6T Linear Pluggable Optics (LPO) solutions garnered significant industry attention, drawing customer interest for their energy efficiency, ultra-low latency, and supply-chain resilience.

Addressing the escalating demands for higher bandwidth densities and stricter power budgets in AI data centers, Linktel's 1.6T LPO solutions, including the 1.6T LPO 2DR4, offer notable performance enhancements. They operate with power consumption as low as approximately 10 watts, substantially reducing data center cooling and power loads. The linear optics architecture minimizes signal processing delays, while the elimination of the optical DSP enhances supply-chain resilience for mass deployments.

The company also highlighted other innovations, such as its 12.8T liquid-cooled XPO module designed for high-density AI nodes, and 6.4T/7.2T NPO modules. Linktel has also introduced transceivers utilizing DMD technology, providing cost-effective solutions for AI networks.

Linktel stated that it is prepared to meet the growing market demand for 1.6T connectivity, with volume production already underway. The company is also open to sharing its patents to foster ecosystem maturity and advance next-generation AI fabrics.