Longsys to showcase Edge AI storage solutions at electronica 2026

Longsys will highlight its latest developments in edge computing storage during the electronica 2026 trade fair, held in Munich from November 10 to 13. As artificial intelligence models shift from centralized cloud environments to local devices, the company aims to address the specific hardware requirements for industrial and automotive sectors, focusing on real-time inference and high-bandwidth processing.

The featured release is an industrial-grade mSSD utilizing System-in-Package (SiP) technology. By consolidating the controller, flash memory, and passive components into a single package, the design removes the need for standard surface-mount assembly. This integration is designed to reduce material usage and eliminate potential hardware failure points associated with traditional solder joints, while providing resistance to environmental factors like moisture and vibration.

Longsys is also expanding its portfolio of UFS, eMMC, LPDDR, and SPI-NAND flash products, which are increasingly critical for automotive applications such as ADAS and industrial control systems. Through its Lexar brand, the company will display storage media intended for professional dashcam and infrastructure use.

The company will hold demonstrations for its AISSD, AIDIMM, and HLCache UFS solutions at its stand, C2.459 in Hall C2, aimed at simplifying system architecture for developers working on edge AI projects.