Micron to Double HBM Memory Production Capacity by End of 2026

Micron Technology is set to significantly expand its production capacity for High Bandwidth Memory (HBM), aiming for a monthly output of 100,000 wafers by the end of 2026. This move represents a doubling of the company's capacity, which is projected to reach 40,000-50,000 wafers per month by the end of 2025.

The expansion will focus on 12Hi HBM4 memory, designed for AI accelerators like NVIDIA's upcoming GPUs. Micron anticipates that these advanced memory modules will constitute 50% of its total HBM production by the close of 2026, a substantial increase from the estimated 20-30% share at the beginning of the year.

To support this aggressive ramp-up, Micron is increasing its orders for HBM manufacturing equipment. New production machinery is currently being delivered to the company's facilities in Taiwan and Singapore.

Industry estimates place the current monthly HBM production capacity of competitors SK Hynix and Samsung Electronics at approximately 150,000-200,000 wafers each, considerably higher than Micron's anticipated 2025 output levels.