NearLink SLE 1.0 chip shipments reach 70 million units
Total shipments for NearLink SLE 1.0 chips have hit 70 million units. Huawei launched the first commercial products utilizing the technology in 2023.
The International NearLink Alliance has released technical documentation for the evolving SLE 3.0 standard, highlighting the market adoption of its predecessor, the SLE 1.0. Since its introduction in November 2022, 70 million SLE 1.0 chips have been shipped.
Commercial adoption accelerated in September 2023 when Huawei integrated NearLink technology into its Mate 60 smartphone series, tablets, and stylus accessories. This move prompted a wider rollout of peripheral devices, including keyboards, mice, gaming controllers, and smart home appliances from various third-party manufacturers.
Currently, more than 40 module manufacturers have developed hardware supporting the SLE 1.0 standard. These modules are designed for diverse applications, including industrial internet, smart sensors, and home security, prioritizing low-latency connections and multi-device coordination.