Nova WMC™ platform selected for advanced packaging processes

REHOVOT, Israel – July 2, 2026 – Nova (NASDAQ: NVMI) announced today that a leading global foundry customer has selected its Nova WMC™ platform for multi-layer measurement within its most advanced packaging processes. The selection followed a competitive evaluation.

The Nova WMC™ platform is designed for semiconductor packaging stages that require high precision in thin film measurement. It enables the measurement of multiple materials and layers in a single pass, aiming to streamline production and enhance quality control.

This foundry's decision to deploy Nova WMC™ across multiple production lines highlights the platform's capability to meet the stringent demands of state-of-the-art semiconductor manufacturing. This move is expected to solidify Nova's position in markets focused on advanced packaging technologies, such as chiplets and novel semiconductor materials.

Nova stated that the customer's requirements and performance metrics confirmed the platform's role in improving the production accuracy of sophisticated packaging solutions. The company anticipates that this adoption will significantly boost the customer's manufacturing efficiency and reduce defect rates.