NovoLINC Launches MaxLINC Thermal Material for AI Chips
NovoLINC has introduced MaxLINC, a new thermal interface material achieving 0.7 mm²•K/W thermal resistance. The material is designed to address the cooling demands of high-power artificial intelligence chips.
PITTSBURGH, Sept. 17, 2026 – NovoLINC, a provider of thermal interface material (TIM) solutions for high-performance computing, announced the launch of MaxLINC today. This new material is engineered to manage the increasing power consumption and heat generated by multi-kilowatt artificial intelligence chips.
The MaxLINC material achieves a thermal resistance of 0.7 mm²•K/W, a figure NovoLINC states is industry-leading. This performance is critical as AI chips continue to increase in power density, leading to higher thermal loads. Effective thermal management is essential for maintaining optimal chip operating temperatures, thereby ensuring performance and longevity.
NovoLINC stated that the development of MaxLINC responds to the growing need for efficient cooling solutions in data centers and high-performance computing applications. The company believes the material will offer customers a competitive advantage by enabling better performance optimization for their AI hardware.
MaxLINC is available immediately. NovoLINC did not disclose specific details regarding the material's composition or manufacturing process but highlighted its suitability for demanding applications.