NSING Technologies ships over 250 million Ceva-powered Bluetooth chips
Semiconductor firm NSING Technologies has reached a milestone of 250 million Bluetooth chip shipments, utilizing IP technology from Ceva.
NSING Technologies has surpassed 250 million units shipped for its Bluetooth chip portfolio, all powered by Ceva-Waves Bluetooth Low Energy (LE) intellectual property. The milestone marks the scale of a multi-year partnership between the two companies, combining Ceva's connectivity IP with NSING's own RF and microcontroller designs.
The chips serve diverse sectors including automotive systems, consumer electronics, smart home, and industrial wireless applications. By utilizing Ceva's pre-validated IP for series such as the N32WB452 and N32WB03x, NSING has streamlined product development cycles while maintaining performance standards across varying use cases.
NSING Vice President Xinhui Mu stated that the milestone confirms the strength of the company’s product portfolio and customer trust. Ceva’s leadership noted that the shipment volume reflects the broader industry trend of integrating standardized connectivity IP to enable mass-market smart edge devices.