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Panasonic Industry Europe Introduces New Thermal Interface Material

Panasonic Industry Europe has launched GraphiteTIM, a new thermal interface material designed to optimize heat dissipation in power modules and enhance device longevity.

23 September 2026

Panasonic Industry Europe has introduced GraphiteTIM, a new thermal interface material (TIM) engineered to improve heat management in power modules. The material aims to address common challenges such as reducing thermal resistance and enhancing long-term reliability.

Heat is a critical factor affecting the performance and lifespan of electronic devices. Elevated temperatures can significantly degrade component reliability. This is particularly crucial for power modules, including IGBTs and SiC MOSFETs used in automotive, renewable energy, and traction applications, where efficient heat dissipation is paramount. Thermal interface materials are necessary to fill air gaps between heat-generating components and heat sinks, thereby minimizing thermal resistance.

Traditional thermal interface materials include thermal greases, phase change materials (PCMs), and thermally conductive sheets. Thermal greases are common and cost-effective but can be difficult to apply evenly and may dry out over time. PCMs soften at high temperatures, improving contact, but their cost and long-term reliability can be concerns. Thermally conductive sheets are easier to handle but require pressure for adequate contact.

Panasonic's new GraphiteTIM is based on a pyrolytic, highly oriented graphite sheet. The material is designed to offer low thermal resistance, stable characteristics throughout the device's lifespan, and ease of application. Its structure is intended to promote efficient heat transfer, which is particularly important in vertical power module designs where traditional materials might leak.

The new material is expected to assist design and production engineers in improving device performance and durability. GraphiteTIM aims to provide a long-lasting and stable solution for the thermal management challenges of power modules.

Original source: industry.panasonic.eu