Panasonic Industry Launches Bluetooth 5 LE Module for Radio-Challenged Applications
Panasonic Industry Europe has introduced the PAN1770, a new Bluetooth 5 Low Energy module designed to overcome signal shielding issues caused by device housings.

Panasonic Industry Europe has launched the PAN1770, a new Bluetooth 5 Low Energy (LE) module equipped with a uFL connector for external antenna use. This addresses the common challenge of radio wave shielding in applications with metal casings or other radio-unfavourable environments.
The PAN1770, based on the nRF52840 chip, offers a combination of high output power (up to 8 dBm) and industry-leading sensitivity, enabling long-range communication. Its ultra-low current consumption makes it suitable for battery-powered devices, while the integrated Cortex M4F processor and ample memory allow for standalone operation, reducing system complexity and cost.
"We have seen that in many devices or applications, radio waves emitted by the chip antenna can be blocked or reflected by the metallic housing, making it difficult to receive the radio signal from the outside," stated Tomislav Tipura from Panasonic Industry Europe. "By using our new PAN1770 module, an external antenna can easily be attached via the uFL connector and thus redirect the radio waves outside the housing."
In addition to its core Bluetooth LE capabilities, the module supports NFC Type 2 for simplified pairing and payment solutions, requiring an external antenna. It also offers support for 802.15.4 standards, including Matter, Zigbee, and Thread. With its compact size and versatile hardware interfaces, the PAN1770 is positioned for use in a wide range of IoT and industrial applications where reliable wireless connectivity is crucial.