Rittal and ZutaCore launch direct chip cooling solution for data centers
Rittal and ZutaCore have unveiled their first joint high-performance computing (HPC) cooling solutions, designed to manage the heat from powerful processors.
Rittal, a global systems provider, and ZutaCore, a liquid cooling specialist, have announced their first joint high-performance computing (HPC) cooling solutions.
The collaboration has yielded two primary products: a rear-door-air (RDA) solution integrated into Rittal's LCP system portfolio, designed for easy deployment in existing data centers without infrastructure modifications. Additionally, the In-Rack Edge solution offers both air-cooled and water-cooled versions, with the latter capable of cooling up to 70 kW of processor power within a single rack.
These new offerings are engineered to address the increasing thermal demands of high-power processors, which can exceed 900W. By leveraging ZutaCore's waterless, two-phase liquid cooling technology, the systems aim to effectively manage hotspots and meet edge computing requirements, thereby mitigating the risk of IT failures.
Industry analysts suggest that direct liquid cooling will become essential for data centers in the coming decade, as air cooling alone struggles to keep pace with the heat output of next-generation processors, while cost and sustainability pressures intensify.
The partnership aims to provide hyperscale and colocation providers with solutions that overcome the limitations of air cooling and eliminate water usage, offering efficient heat dissipation from the chip level up to the data center scale.