Rittal integrates racks, cooling, and power for AI data centers

Rittal is set to present a new architecture at the OCP Global Summit 2026 in San José, integrating racks, direct liquid cooling, and DC power supply into a single, scalable system. This solution addresses the growing demands of artificial intelligence and high-performance computing (HPC) applications, which require increased computing power and higher power densities in data centers.

The core of the new approach features a mechanically and functionally integrated unit capable of accommodating megawatt-level computing power within a compact footprint. This design aims to reduce energy losses, facilitate scalability, and simplify servicing. The system utilizes 800-volt power electronics technology for energy conversion, supplied by Bosch. Bosch produces this technology for mass-market electric vehicles and is adapting it for data center operations.

Rittal has developed its own Coolant Distribution Unit (CDU) to provide megawatt-level cooling output directly to the chips. This unit, combined with OCP-compliant racks and the Bosch-powered energy supply unit, forms a scalable and reproducible infrastructure. As a long-standing member of the Open Compute Project, Rittal is also a major global supplier of racks to hyperscalers.

The architecture adheres to open OCP standards and supports the transition to 800 V DC infrastructures. Rittal's CTO, Philipp Guth, emphasized the need for industrially scalable white space architecture for AI data centers. The collaboration with Bosch merges system expertise with efficient power management, enabling the development of globally plannable and deployable solutions.