Rittal presents AI-era data center infrastructure at OCP summit

Rittal is set to unveil an integrated infrastructure solution at the OCP EMEA Summit in Barcelona, taking place from April 29–30, 2026. The concept addresses the escalating demands of artificial intelligence (AI) and high-performance computing (HPC) on data center infrastructure worldwide.

The focus is on a standardized unit that combines computing power, cooling, and power supply, tailored for high-density AI and HPC applications utilizing Open Compute Project (OCP) architectures. This aims to tackle the challenges of increased power density and the need for rapid scalability in modern data centers.

The solution features a compact "pod" that directly integrates computing power, direct water-based chip cooling, and power distribution. It is designed to accommodate over one megawatt of power within a small footprint. The system bundles a cooling distribution unit (CDU), high-performance racks for compute modules, and a "sidecar" for DC power generation and distribution, aiming to reduce losses and enhance scalability. Rittal is collaborating with DG Matrix to incorporate their Solid-State Transformer (SST) technology for power supply, ensuring compatibility with various voltage environments and adherence to OCP and NVIDIA specifications. Thomas Schreiner, Head of Business Development Hyperscale at Rittal, highlighted the importance of these systems for the digital future.