Rohde & Schwarz and Realtek Demonstrate Bluetooth LE HDT Test Solution

Munich – Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature. The companies will jointly showcase the setup, based on the Rohde & Schwarz CMP180 radio communication tester, which characterizes Realtek’s next generation Bluetooth solutions RTL8922D and RTL8773J. Demonstrations will take place at MWC Barcelona 2026 and embedded world 2026 in Nuremberg.

The Bluetooth LE HDT feature is a key component for the next generation of Bluetooth LE devices. It increases the maximum data rate from 2 Mbps to 7.5 Mbps, significantly enhancing traditional use cases and enabling new ones, such as low-latency audio streaming, fast media sharing, and accelerated over-the-air software updates. Technically, the HDT feature offers up to four times increased capacity, improved energy efficiency, better spectrum efficiency, and enhanced reliability.

Realtek's new RTL8922D Wi-Fi/Bluetooth combo chip and RTL8773J Bluetooth audio SoC provide a comprehensive platform for high-performance wireless and audio applications. The RTL8922D supports HDT, channel sounding, and IEEE 802.15.4 integration, enabling simultaneous Wi-Fi, dual Bluetooth, and Zigbee/Thread connectivity. The RTL8773J is a dedicated Bluetooth audio chip that unifies Legacy Bluetooth, Bluetooth LE, LE Audio, and HDT, delivering energy-efficient, low-latency audio processing.

Rohde & Schwarz and Realtek will demonstrate the Bluetooth LE HDT testing at two major industry events. At MWC Barcelona 2026 (March 2-5, 2026), the solution will be featured at the Rohde & Schwarz booth (Hall 5, Booth 5A80). At the embedded world Exhibition & Conference in Nuremberg (March 10-12, 2026), visitors can see the demonstration at the Rohde & Schwarz booth (Hall 4, Booth 218) and the Realtek booth (Hall 3A, Booth 325).