Samsung Exynos 2700 Chip Reportedly Separates Memory Packaging for Improved Cooling
Reports suggest Samsung is redesigning its upcoming Exynos 2700 chip with a new packaging strategy. The goal is to improve cooling by separating the DRAM memory from the SoC.
Samsung is reportedly altering its packaging strategy for the upcoming Exynos 2700 processor to significantly enhance its thermal management. This move comes as a response to previous overheating issues encountered with the Exynos 2600.
The Exynos 2700 is expected to utilize a Die-Stacked (DS) or Side-by-Side (SBS) packaging approach, separating the DRAM memory from the System-on-Chip (SoC). In contrast, the Exynos 2600 integrated LPDDR5X memory onto the SoC and relied on additional thermal solutions like Heat Pass Block (HPB). Despite these measures, the Exynos 2600 faced heat buildup challenges due to the proximity of the memory and SoC.
The new SBS packaging positions the DRAM and SoC adjacent to each other within the same package. This configuration facilitates more efficient heat dissipation, directly addressing the thermal concerns of the predecessor. Additionally, proximity of memory and SoC can reduce data transfer path lengths, potentially boosting memory bandwidth by 30% to 40%.
This development in packaging technology is also observed in competitor offerings, with Apple's upcoming A20 Pro chip reportedly adopting a similar WMCM packaging solution. Such advancements are crucial for mobile processors performing under increasingly demanding workloads.
The industry is closely watching how these packaging innovations will impact the performance and reliability of high-end mobile chipsets as manufacturers push the boundaries of processing power and thermal efficiency.