SCY Begins Sample Shipments of QLC UFS 2.2 Embedded Flash Memory
Memory module manufacturer SCY (时创意) has initiated sample shipments of its new QLC NAND-based UFS 2.2 embedded flash memory. The product is available in 128GB, 256GB, and 512GB capacities.

Memory module manufacturer SCY (时创意) announced on September 23 that it has officially begun sample shipments for its new embedded flash memory utilizing QLC NAND technology and adhering to the UFS 2.2 standard.
The new memory chips are offered in three storage capacities: 128GB, 256GB, and 512GB. Sequential read speeds can reach up to 1080 MB/s, and sequential write speeds up to 860 MB/s. According to SCY, these performance metrics are up to three times faster than eMMC storage solutions. The chips also feature a 4K LDPC ECC error correction engine and support for Write Booster technology.
SCY's QLC UFS 2.2 flash memory is packaged in a 11.5 x 13.0 x 0.95 mm BGA format, designed for compatibility with mainstream mobile SoC platforms. The target applications include mid-range and entry-level 5G smartphones, tablet and audio-visual entertainment devices, as well as smart home control and voice interaction equipment.