Semifive to Develop Robotics AI Chip for Mobilint Under Government Program
SEMIFIVE has signed a contract with Mobilint to develop an AI chip for robotics applications as part of South Korea's 'K-On-Device AI Semiconductor' program. The chip aims to enable high-performance AI computation in outdoor environments.
SEMIFIVE, a provider of custom AI semiconductor (ASIC) solutions, has entered into a turnkey development contract with Mobilint, a South Korean AI semiconductor company, to create an AI chip for robotics. This initiative is part of the "K-On-Device AI Semiconductor Technology Development" program, led by South Korea's Ministry of Trade, Industry and Resources (MOTIR), which aims to commercialize domestic AI chips.
The collaboration focuses on developing a chip capable of high-performance AI computation independently, even in environments with limited connectivity, such as outdoor settings. The chip is intended for applications like agricultural robots, where it will process vision and sensor data in real-time under diverse operating conditions.
The project will utilize SEMIFIVE's "Spec Hand-off" model, where the company handles the entire process from detailed design to packaging, testing, and mass production based on customer-defined specifications. The chip will integrate next-generation technologies including LPDDR6, PCIe Gen6, and UCIe-S, designed to ensure high power efficiency and operational stability without data bottlenecks.
Both companies anticipate that this collaboration will bolster South Korea's domestic AI semiconductor ecosystem and establish an early lead in next-generation robotics platforms. "This contract marks a pivotal moment for SEMIFIVE as we extend our proven, end-to-end ASIC capabilities... into the realm of robotics AI," stated SEMIFIVE CEO Brandon Cho.