Siemens, TSMC Expand AI-Powered Chip Design Collaboration
Siemens and TSMC have expanded their collaboration on AI-powered semiconductor design automation. The initiative aims to boost customer productivity and shorten design cycles.
German industrial technology company Siemens announced on September 29 an expansion of its work with TSMC on AI-powered semiconductor design automation. The collaboration aims to help mutual customers improve productivity, shorten design cycles, and manage the increasing complexity of chip design.
The expanded partnership involves an AI-powered agent for automated fixing of design rule check errors across digital and custom integrated circuit design flows, utilizing Siemens' Calibre, Aprisa, and Solido software. It also encompasses agentic workflows for custom integrated circuit design, placement, and routing, as well as digital implementation.
Siemens stated that its electronic design automation portfolio supports TSMC's advanced process technologies, including 3D integrated circuits and advanced packaging. This includes support for TSMC's 3DFabric, silicon photonics, and chip-package co-design workflows.
This move builds upon an existing relationship rather than establishing a new one. Siemens is already part of TSMC's Open Innovation Platform ecosystem. The expansion aligns with broader industry trends, as seen in TSMC's previous collaborations, such as its partnership with Synopsys on AI-focused electronic design automation flows.