SK Hynix Receives TSMC Partner Award for HBM5 Validation
SK Hynix has been recognized by TSMC with a partner award for its work on HBM5 memory validation using the CoWoS platform. This marks the second consecutive year the company has received this honor.
SK Hynix announced it has received a TSMC Partner Award for its validation of HBM5 memory on the CoWoS 2.5D advanced packaging platform. The award was presented in the "3DFabric-HBM integration" category, marking the second consecutive year SK Hynix has been honored by TSMC.
The award ceremony was part of the 2026 TSMC Open Innovation Platform Ecosystem Forum. At the event, SK Hynix also showcased its latest high-performance memory products, including its 12-high 48GB HBM4E memory.
Additionally, SK Hynix revealed its plans to develop chiplet-based controller solutions for future PCIe Gen6 and Gen7 solid-state drives. The company intends to decompose the complete controller into multiple functional modules interconnected via UCIe. This approach aims to accelerate iteration and shorten development cycles for these components.
Projections shared by SK Hynix PCIe engineer Park Daesik indicate a significant growth forecast for the enterprise SSD (eSSD) market utilizing PCIe technology. The market is expected to expand from 509 EB in 2026 to 1933 EB by 2030, representing a nearly fourfold increase.