SK hynix Unveils First HBF Standard Specifications

SK hynix has released the initial specifications for the Hybrid Bonding Flash (HBF) standard, developed in partnership with Sandisk. The specifications were presented six months after the consortium's launch and expand the ecosystem with participation from Google and Tenstorrent.

The technology is designed to provide solutions for next-generation artificial intelligence memory. SK hynix Executive Vice President Kim Chun-sung and Vice President Kang Uk-song presented the solutions at the FMS 2026 event.

These new specifications represent a significant advancement in memory technology, particularly to meet the growing demands of AI applications. The HBF standard is expected to enable higher storage densities and improved performance in memory devices.